Vision Engineering has teamed up with industry-expert Bob Willis to bring you a FREE Electronics Academy Webinar Series, taking an in-depth look at the issues affecting PCB/SMT assembly and the challenges of achieving Zero Defect Manufacture.
Covering a range of topics from Solder Joint Inspection to Counterfeit Component Detection, the free webinar series is a great way to gain valuable insight and learn expert tips to identify quality issues and understand the common causes of solder joint failure.
Thursday 16th June
Solder Joint Inspection & Process Defects
Wednesday 29th June 2016
Counterfeit Component Inspection & Detection
Thursday 21st July 2016
Conformal Coating Inspection & Coating Faults
Thursday 15th September 2016
Crimp Connector Inspection & Quality Control
Wednesday 12th October 2016
Printed Circuit Board Inspection & Quality Control
Thursday 10th November 2016
Inspection of Conductive Adhesive Joints
In the first webinar, Bob will explain the best ways to inspect solder joints on conventional and surface mount assemblies with reference to international standards (e.g. IPC 610 and IPC J-STD-001). In addition, the webinar will illustrate some of the most common joint failures, why they occur and the corrective action required.
Places are limited, so sign-up now »
About Bob Willis
Bob Willis is a globally-recognised expert in surface mount and area array technology, providing training and consultancy to electronics manufacturers worldwide for the past 30 years.
He is a Fellow of the Institute Circuit Technology, an NVQ Assessor, Member of the SMART Group Technical Committee, Member of the Institute of Quality Assurance and Society of Environmental Test Engineers.
Bob regularly speaks at international events, providing expert knowledge to improve skills and knowledge for electronics production staff and engineers.