The webinars in this series include the following:
Future webinars in the series will continue in 2017 and include:
- Component inspection and recognition
- Inspection of underfill and staked components
- Solder paste and stencil inspection
- Microsection inspection
- Destructive solder joint assessment and inspection
About Bob Willis
Bob Willis is a globally-recognised expert in surface mount and area array technology, providing training and consultancy to electronics manufacturers worldwide for the past 30 years.
He is a Fellow of the Institute Circuit Technology, an NVQ Assessor, Member of the SMART Group Technical Committee, Member of the Institute of Quality Assurance and Society of Environmental Test Engineers.
Bob regularly speaks at international events, providing expert knowledge to improve skills and knowledge for electronics production staff and engineers.